Blog review: October 27
UVM and Python; export regulations in the EDA; HBM3 functionalities; technology in the field of health.
Siemens EDA Ray salemi continues to study the use of Python for verification by examining how pyuvm simplifies and refactors the UVM TLM system to take advantage of the fact that Python has multiple inheritance and no typing.
cadence Paul McLellan listens to Larry Disenhof explain the impact that export regulations have on EDA tools and IP products and the changes in a rapidly changing landscape, including how tools are categorized.
A Synopsis The author highlights the main differentiating features of HBM3, including a pseudo-channel mode architecture, a dual clock architecture, and a provision for on-chip ECC computing.
In a podcast, Arm’s Geof charron and Rob Aitken discuss with Matthew Griffin of the 311 Institute the impact technology and AI could have on the healthcare industry over the next 10-20 years, including opportunities for hospitals and major ethical and safety concerns that may arise.
In a blog for SEMI, Ansys’ John lee advocates for the value of multiphysics simulation and multivariate analysis in 3D-IC design to assess the risks of high frequency signal failure, reliability, and other performance issues such as thermal buildup.
Western Digital Ronni shendar examines how to handle the huge amounts of data that satellites collect and return to Earth and the information that can be obtained by analyzing it.
Rambus chats with Shane Rau from IDC on why the time between main memory generations is lengthening and the interplay between capacity, bandwidth and latency.
And don’t miss the blogs featured in last week’s Manufacturing, Packaging & Materials newsletter:
Editor-in-chief Mark LaPedus focuses on key lithography technology.
Amkor’s Yongjai Seo demonstrates how to combine multiple functions into a single SiP without interference.
Jan Willis of eBeam Initiative examines which design layout target shapes will perform best with the smallest footprint.
Yu De Chen from Coventor explains how to use virtual fabrication to study profile variation in a 5nm finFET.
Kim Sin of SEMI observes that China’s semiconductor industry is rapidly becoming one of the largest in the world.
TechInsight’s Stacy Wegner, Daniel Yang, and Ziad Shukry dissect a major consumer device.
Jessica Albright of Brewer Science discusses the most common applications of periodic condition monitoring.
Onto’s Prasad Bachiraju recommends pre-classifying defects and classifying defective dies during inspection to meet reliability requirements.
Jesse Allen is the Administrator of the Knowledge Center and a Senior Editor at Semiconductor Engineering.